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? 2005 microchip technology inc. ds21661d-page 1 tcm809/tcm810 features ? precision v dd monitor for 2.5v, 3.0v, 3.3v, 5.0v nominal system voltage supplies ? 140 msec minimum reset time-out period ? reset output to v dd = 1.0v ( tcm809 ) ? low supply current, 9 a (typ.) ?v dd transient immunity ? small 3-pin sc-70 and sot-23b packages ? no external components ? push-pull reset output ? temperature ranges: - industrial: sc-70 (e): -40 c to +85 c - extended: sot-23, sc-70 (v): -40 c to +125 c applications ? computers ? embedded systems ? battery-powered equipment ? critical microcontroller power supply monitoring ? automotive typical application circuit general description the tcm809 and tcm810 are cost-effective system supervisor circuits designed to monitor v dd in digital systems; providing a reset signal to the host processor, when necessary. no external components are required. the reset output is typically driven active within 65 sec of v dd falling through the reset voltage thresh- old. reset is maintained active for a minimum of 140 msec after v dd rises above the reset threshold. the tcm810 has an active-high reset output, while the tcm809 has an active-low reset output. the output of the tcm809/tcm810 is valid down to v dd = 1v. both devices are available in 3-pin sc-70 and sot-23b packages. the tcm809/tcm810 are optimized to reject fast transient glitches on the v dd line. a low supply current of 9 a (typ., v dd = 3.3v) make these devices suitable for battery-powered applications. pin configurations 1 tcm809 v dd v dd v dd reset reset input (active-low) gnd gnd picmicro ? microcontroller 3 2 sot-23b/sc-70 note: 3-pin sot-23b is equivalent to v dd tcm809 reset gnd tcm809/ tcm810 1 2 tcm810 (reset) 3 jedec to-236. 3-pin microcontroller reset monitors
tcm809/tcm810 ds21661d-page 2 ? 2005 microchip technology inc. 1.0 electrical characteristics absolute maximum ratings? supply voltage (v dd to gnd) ........................................................6.0v reset , reset ................................................... -0.3v to (v dd +0.3v) input current, v dd .......................................................................20 ma output current, reset , reset.... .............................................20 ma dv/dt (v dd )........................................................................... 100v/sec operating temperature range ...................................-40c to +125c power dissipation (t a = 70c): 3-pin sot-23b (derate 4 mw/c above +70c) ....................320 mw 3-pin sc-70 (derate 2.17 mw/c above +70c)....................174 mw storage temperature range .......................................-65c to +150c maximum junction temperature, t j ............................................ 150c ? notice: stresses above those listed under ?maximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this sp ecification is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. electrical characteristics v dd = full range, t a = operating temperature range, unless otherwise noted. typical values are at t a = +25c, v dd = 5v for l/m/j, 3.3v for t/s, 3.0v for r and 2.5v for z (note 1) . parameter sym min typ max units test conditions v dd range 1.0 ? 5.5 v t a = 0c to +70c 1.2 ? 5.5 t a = ? 40c to +125c supply current i cc ?1230a tcm8xx l/m/j: v dd < 5.5v ?925 tcm8xx r/s/t/z: v dd < 3.6v reset threshold (note 2) v th 4.56 4.63 4.70 v tcm8xx l: t a = +25c 4.50 ? 4.75 t a = ? 40c to +125c 4.31 4.38 4.45 v tcm8xx m: t a = +25c 4.25 ? 4.50 v t a = ? 40c to +125c 3.93 4.00 4.06 v tcm809 j: t a = +25c 3.89 ? 4.10 v t a = ? 40c to +125c 3.04 3.08 3.11 v tcm8xx t: t a = +25c 3.00 ? 3.15 v t a = ? 40c to +125c 2.89 2.93 2.96 v tcm8xx s: t a = +25c 2.85 ? 3.00 v t a = ? 40c to +125c 2.59 2.63 2.66 v tcm8xx r: t a = +25c 2.55 ? 2.70 v t a = ? 40c to +125c 2.28 2.32 2.35 v tcm8xx z: t a = +25c 2.25 ? 2.38 v t a = ? 40c to +125c reset threshold tempco ? 30 ? ppm/c v dd to reset delay, ? 65 ? sec v dd = v th to (v th ? 100 mv) (note 2) reset active time out period 140 320 560 msec reset output voltage low ( tcm809 ) v ol ??0.3v tcm809 r/s/t/z: v dd = v th min, i sink = 1.2 ma ??0.4 tcm809 l/m/j: v dd = v th min, i sink = 3.2 ma ??0.3 v dd > 1.0v, i sink = 50 a reset output voltage high ( tcm809 ) v oh 0.8 v dd ??v tcm809 r/s/t/z: v dd > v th max, i source = 500 a v dd ? 1.5 ? ? tcm809 l/m/j: v dd > v th max, i source = 800 a reset output voltage low ( tcm810 ) v ol ??0.3v tcm810 r/s/t/z:v dd = v th max, i sink = 1.2 ma ??0.4 tcm810 l/m: v dd = v th max, i sink = 3.2 ma reset output voltage high ( tcm810 ) v oh 0.8 v dd ??v1.8 < v dd < v th min, i source = 150 a note 1: production testing done at t a = +25c, overtemperature limits ensured by qc screen. 2: reset output for tcm809 , reset output for tcm810 .
? 2005 microchip technology inc. ds21661d-page 3 tcm809/tcm810 2.0 typical performance characteristics figure 2-1: supply current vs. temperature. figure 2-2: supply current vs. temperature. figure 2-3: power-up reset time out vs. temperature. figure 2-4: normalized reset threshold vs. temperature. note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0 2 4 6 8 10 12 14 16 18 -40 -20 0 20 40 60 80 100 120 temperature (c) supply current ( a) v dd = 1v v dd = 3v v dd = 5v tcm8xx/r/s/t/z, no load 0 2 4 6 8 10 12 14 16 -40-20 0 20406080100120 temperature (c) supply current ( a) v dd = 5v v dd = 3v v dd = 1v tcm8xx/l/m/j, no load 0 50 100 150 200 250 300 350 400 450 -40 -20 0 20 40 60 80 100 120 temperature (c) power-up reset timeout (sec) 0.997 0.998 0.999 1 1.001 -40-20 0 20406080100120 temperature (c) normalized reset threshold
tcm809/tcm810 ds21661d-page 4 ? 2005 microchip technology inc. 3.0 pin descriptions the descriptions of the pins are given in table 3-1. table 3-1: pin function table 3.1 ground (gnd) ground terminal. 3.2 r eset output (tcm809) the res e t push-pull output remains low while v dd is below the reset voltage threshold, and for 240 msec (140 msec min.) after v dd rises above reset threshold. 3.3 reset output (tcm810) the reset push-pull output remains high while v dd is below the reset voltage threshold, and for 240 msec (140 msec min.) after v dd rises above reset threshold. 3.4 supply voltage (v dd ) v dd : +2.5v, +3.0v, +3.3v and +5.0v name function gnd ground reset ( tcm809 ) reset push-pull output reset ( tcm810 ) reset push-pull output v dd supply voltage (+2.5v, +3.0v, +3.3v, +5.0v).
? 2005 microchip technology inc. ds21661d-page 5 tcm809/tcm810 4.0 applications information 4.1 v dd transient rejection the tcm809/tcm810 provides accurate v dd monitor- ing and reset timing during power-up, power-down and brown-out/sag conditions. these devices also reject negative-going transients (glitches) on the power supply line. figure 4-1 shows the maximum transient duration vs. maximum negative excursion (overdrive) for glitch rejection. any combination of duration and overdrive that lies under the curve will not generate a reset signal. figure 4-1: maximum transient duration vs. overdrive for glitch rejection at +25c. combinations above the curve are detected as a brown-out or power-down condition. transient immunity can be improved by adding a capacitor in close proximity to the v dd pin of the tcm809/tcm810. 4.2 reset signal integrity during power-down the tcm809 reset output is valid to v dd = 1.0v. below this voltage the output becomes an "open cir- cuit" and does not sink current. this means cmos logic inputs to the microcontroller will be floating at an undetermined voltage. most digital systems are completely shut down well above this voltage. however, in situations where reset must be main- tained valid to v dd = 0v, a pull-down resistor must be connected from reset to ground to discharge stray capacitances and hold the output low (figure 4-2). this resistor value, though not critical, should be chosen such that it does not appreciably load reset under normal operation (100 k will be suitable for most applications). similarly, a pull-up resistor to v dd is required for the tcm810 to ensure a valid high reset for v dd below 1.0v. figure 4-2: the addition of r 1 at the reset output of the tcm809 ensures that the reset output is valid to v dd = 0v. reset comparator overdrive [v th ? v dd ] (mv) 400 240 160 320 80 0 1 5 100 1000 t a = +25c v th duration overdrive v dd tcm8xx l/m/j (sot-23) maximum transient duration (sec) tcm8xx z/r/s/t (sot-23) [v th ? v dd ] (mv) 30 40 50 60 70 80 90 100 110 120 130 1 10 100 1000 reset comparator overdrive (mv) v dd to reset delay (sec) tcm8xx l/m/j (sc-70) tcm8xx z/r/s/t (sc-70) tcm809 v dd v dd r 1 100 k reset gnd
tcm809/tcm810 ds21661d-page 6 ? 2005 microchip technology inc. 4.3 controllers and processors with bidirectional i/o pins some microcontrollers have bidirectional reset pins. depending on the current drive capability of the control- ler pin, an indeterminate logic level may result if there is a logic conflict. this can be avoided by adding a 4.7 k resistor in series with the output of the tcm809/ tcm810 (figure 4-3). if there are other components in the system that require a reset signal, they should be buffered so as not to load the reset line. if the other components are required to follow the reset i/o of the microcontroller, the buffer should be connected as shown with the solid line. figure 4-3: interfacing the tcm809 to a bidirectional reset i/o. tcm809 v dd reset gnd reset gnd buffered reset to ot h er s y st em components micro- 4.7 k controller buffer picmicro ?
? 2005 microchip technology inc. ds21661d-page 7 tcm809/tcm810 5.0 packaging information 5.1 package marking information 3-pin sot-23b xxnn legend: xx...x customer-specific information* y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e example: customer specific information codes for: tcm8xx = part number tcm809 tcm810 tcm8xx lenb j1 k1 vnb jz kz tcm8xx menb j2 k2 vnb jy ky tcm8xx tenb j3 k3 vnb jx kx tcm8xx senb j4 k4 vnb jv kv tcm8xx renb j5 k5 vnb ju ku tcm8xx j enb j6 ? vnb jt ks tcm8xx zenb j7 k6 3-pin sc-70 top side bottom side xxn yww or xxnn example: customer specific information codes for: tcm8xx = part number tcm809 tcm810 tcm8xx l elb j1 ? vlb jz kz tcm8xx m elb j2 ? vlb jy ky tcm8xx t elb j3 ? vlb jx kx tcm8xx s elb j4 ? vlb jv kv tcm8xx r elb j5 ? vlb ju ku tcm8xx j elb j6 ? vlb jt ks tcm8xx z elb j7 ? vlb js kt
tcm809/tcm810 ds21661d-page 8 ? 2005 microchip technology inc. 3-lead plastic small outline transistor (nb) (sot-23) 10 5 0 10 5 0 mold draft angle bottom 10 5 0 10 5 0 mold draft angle top 0.51 0.44 0.37 .020 .017 .015 b lead width 0.18 0.14 0.09 .007 .006 .004 c lead thickness 10 5 0 10 5 0 foot angle 0.55 0.45 0.35 .022 .018 .014 l foot length 3.04 2.92 2.80 .120 .115 .110 d overall length 1.40 1.30 1.20 .055 .051 .047 e1 molded package width 2.64 2.37 2.10 .104 .093 .083 e overall width 0.10 0.06 0.01 .004 .002 .000 a1 standoff 1.02 0.95 0.88 .040 .037 .035 a2 molded package thickness 1.12 1.01 0.89 .044 .040 .035 a overall height 1.92 .076 p1 outside lead pitch (basic) 0.96 .038 p pitch 3 3 n number of pins max nom min max nom min dimension limits millimeters inches* units 2 1 p d b n e e1 l c a2 a a1 p1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: to-236 drawing no. c04-104 significant characteristic
? 2005 microchip technology inc. ds21661d-page 9 tcm809/tcm810 3-lead plastic small outline transistor (lb) (sc-70) 12 8 12 8 b mold draft angle bottom 12 8 12 8 a mold draft angle top 0.40 0.15 .016 .006 b lead width 0.25 0.08 .010 .003 c lead thickness 0.41 0.10 .016 .004 l foot length 2.25 1.80 .089 .071 d overall length 1.35 1.15 .053 .045 e1 molded package width 2.40 1.80 .094 .071 e overall width .010 0.00 .0004 .000 a1 standoff 1.00 0.80 .039 .031 a2 molded package thickness 1.10 0.80 .043 .031 a overall height 1.30 bsc. p1 outside lead pitch (basic) 0.65 bsc. p pitch 3 3 number of pins max min max min dimension limits millimeters* inches units shall not exceed .005" (0.127mm) per side. dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions notes: jeita (eiaj) equivalent: sc70 drawing no. c04-104 *controlling parameter l b e1 e p c p1 d 1 2 3 b a a a2 a1 .026 bsc. .051 bsc.
tcm809/tcm810 ds21661d-page 10 ? 2005 microchip technology inc. 5.2 product tape and reel specifications figure 5-1: embossed carrier dimensions (8, 12, 16 and 24 mm tape only) figure 5-2: 3-lead sot-23/sc70 d evice tape and reel specifications to p cover tape k 0 p w b 0 a 0 table 1: carrier tape/cavity dimensions case outline package type carrier dimensions cavity dimensions output quantity units reel diameter in mm w mm p mm a0 mm b0 mm k0 mm nb sot-23 3l 8 4 3.15 2.77 1.22 3000 180 lb sc-70 3l 8 4 2.4 2.4 1.19 3000 180 us e r dir e ction of f ee d p, pitch standard r ee l compon e nt ori e ntation r e v e rs e r ee l compon e nt ori e ntation w, width of carri e r tap e pin 1 pin 1 d e vic e marking d e vic e marking
? 2005 microchip technology inc. ds21661d-page 11 tcm809/tcm810 appendix a: revision history revision d (march 2005) ? updated 6.0 ?packaging information? to include old and new packaging examples. ? applied new template and rearranged sections to be consistent with current documentation. revision c (april 2004) revision b (january 2002) revision a (may 2001) initial release of data sheet.
tcm809/tcm810 ds21661d-page 12 ? 2005 microchip technology inc. notes:
? 2005 microchip technology inc. ds21661d-page 13 tcm809/tcm810 product identification system to order or obtain information, e. g., on pricing or delivery, refer to the factory or the listed sales office . sales and support device: tcm809: supervisor circuit with active-low reset output tcm810: supervisor circuit with active-high reset output v dd reset threshold: l = 4.63v m=4.38v j=4.00v t=3.08v s=2.93v r=2.63v z=2.32v temperature range: e = -40c to +85c v = -40c to +125c package: nb713 = sot-23b, 3-pin (tape and reel) lb713 = sc-70, 3-pin (tape and reel) part no. x x temperature v dd reset device examples: a) tcm809lenb713: sot-23b-3-tr, microcontroller 4.63v reset monitor, -40c to +85c, tape and reel. b) tcm809lvlb713: sc-70-3-tr, microcontroller 4.63v reset monitor, -40c to +125c, tape and reel. c) tcm809lvnb713: sot-23b-3-tr, microcontroller 4.63v reset monitor, -40c to +125c, tape and reel. a) tcm810menb713: sot-23b-3-tr, microcontroller 4.38v reset monitor, -40c to +85c, tape and reel. b) tcm810rvlb713: sot-23b-3-tr, microcontroller 2.63v reset monitor, -40c to +125c, tape and reel. c) tcm810tvlb713: sc-70-3-tr, microcontroller 4.38v reset monitor, -40c to +125c, tape and reel. range threshold xxxxx package data sheets products supported by a preliminary data sheet may have an errata sheet describing minor operational differences and recommended workarounds. to determine if an errata sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip corporate literature center u.s. fax: (480) 792-7277 3. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. customer notification system register on our web site (www.microchip.com) to receive the most current information on our products.
tcm809/tcm810 ds21661d-page 14 ? 2005 microchip technology inc. notes:
? 2005 microchip technology inc. ds21661d-page 15 information contained in this publication regarding device applications and the like is prov ided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application m eets with your specifications. microchip makes no representations or war- ranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip?s products as critical components in life support systems is not authorized except with express written approval by microchip. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, accuron, dspic, k ee l oq , micro id , mplab, pic, picmicro, picstart, pro mate, powersmart, rfpic, and smartshunt are registered trademarks of micr ochip technology incorporated in the u.s.a. and other countries. amplab, filterlab, migratable memory, mxdev, mxlab, picmaster, seeval, smartsensor and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, app lication maestro, dspicdem, dspicdem.net, dspicworks, ecan, economonitor, fansense, flexrom, fuzzylab, in-circuit serial programming, icsp, icepic, mpasm, mplib, mplink, mpsim, pickit, picdem, picdem.net, piclab, pictail, powercal, powerinfo, powermate, powertool, rflab, rfpicdem, select mode, smart serial, smarttel, total endurance and wiperlock are tr ademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2005, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip produc ts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona and mountain view, california in october 2003. the company?s quality system processes and procedures are for its picmicro ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified.
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